Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part I: Creep constitutive relation and fatigue model |
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Authors: | Shi Xunqing Wang Zhiping John HL Pang Zhang Xueren Nie Jingxu |
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Institution: | (1) Dept. of Power Eng., Beijing Univ. of Aeronautics & Astronautics, 100083 Beijing, China;(2) School of Mech. & Prod. Eng., Nanyang Technological Univ., Nanyang Avenue, 639798, Singapore |
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Abstract: | In this study, a new unified creep constitutive relation and a modified energy-based fatigue model have been established respectively
to describe the creep flow and predict the fatigue life of Sn−Pb solders. It is found that the relation successfully elucidates
the creep mechanism related to current constitutive relations. The model can be used to describe the temperature and frequency
dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part II to develop
the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.
The project supported by the National Natural Science Foundation of China (59705008) |
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Keywords: | dislocation controlled creep flow creep-fatigue interaction constitutive relation life prediction model solder joint reliability |
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