Study of failure modes of microelectronic packaging modules by holography quasi projection moire method |
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| Authors: | Shi Xunqing Liu Baochen Dai Fulong |
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| Institution: | (1) Dept. of Power Eng., Beijing Univ. of Aeronautics & Astronautics, 100083 Beijing, China;(2) Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, China |
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| Abstract: | In this paper, a novel interferometric method with a wide range of sensitivities, called holography quasi projection moire,
is proposed. It combines the features of the variated double projection moire method and the holographic interferometry method.
This technique is used to study the failure modes of microelectronic packaging modules.
The project supported by the National Natural Science Foundation of China |
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| Keywords: | holography quasi projection moire sensitivity failure modes packaging modules |
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