| DISPERSION OF NANODIAMOND AND ULTRA-FINE POLISHING OF QUARTZ WAFER |
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| 作者姓名： | YongweiZhu ZhijingFeng BaichunWang XianyangXu |
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| 作者单位： | [1]ResearchandDevelopmentCenter,ChangshaResearchInstituteofMiningandMetallurgy,Changsha410012,China [2]Authortowhomcorrespondenceshouldbeaddressed,ChangshaResearchInstituteofMiningandMetallurgy,Changsha410012,China [3]DepartmentofPrecisionInstrumentsandMechanology,TsinghuaUniversity,Beijing100084,China |
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| 摘 要： | Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in the pH range 8-11. A super smooth surface with an average roughness of 0.214 nm was achieved using a nanodiamond-based slurry regulated by N-(2-hydroxyethyl)ethylenediamine. It is suggested that the principal ultra-fine polishing mechanism of auartz wafer involves atom-level removal under the synergism of chemical and mechanical actions.
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| 关 键 词： | 石英晶片 纳米金刚石 机械化学修正 超细磨料 |
DISPERSION OF NANODIAMOND AND ULTRA-FINE POLISHING OF QUARTZ WAFER |
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| YongweiZhu ZhijingFeng BaichunWang XianyangXu.DISPERSION OF NANODIAMOND AND ULTRA-FINE POLISHING OF QUARTZ WAFER[J].China Particuology,2004,2(4):153-156. |
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| Authors: | Yongwei Zhu Zhijing Feng Baichun Wang and Xianyang Xu |
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| Institution: | Yongwei Zhu1,2,*,Zhijing Feng1,Baichun Wang2 and Xianyang Xu2,3 1Department of Precision Instruments and Mechanology,Tsinghua University,Beijing 100084,China 2Research and Development Center,Changsha Research Institute of Mining and Metallurgy,Changsha 410012,China 3School of Materials Science and Engineering,Central South University,Changsha 410083,China |
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| Abstract: | Mechanochemical Modification (MCM) of nanodiamond surface with DN-10 was studied in relation to the performance of nanodiamond in polishing quartz wafers. Results show that the modified nanodiamond is more stable in the pH range 8~11. A super smooth surface with an average roughness of 0.214 nm was achieved using a nanodia-mond-based slurry regulated by N-(2-hydroxyethyl)ethylenediamine. It is suggested that the principal ultra-fine polishing mechanism of quartz wafer involves atom-level removal under the synergism of chemical and mechanical actions. |
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| Keywords: | nanodiamond dispersion mechanochemical modification ultra-fine polishing quartz wafer |
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