Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling |
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| Authors: | C -H Chien Y -C Chen C -C Hsieh Y -T Chiou Y -D Wu T -P Chen |
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| Institution: | (1) Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-Sen University, Taiwan;(2) Department of Vehicle Engineering, National Pingtung University of Science and Technology, Taiwan;(3) Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-Sen University, Taiwan;(4) Electronics Research and Service Organization, Industrial Technology Research Institute, Taiwan;(5) Department of Mechanical and Electro-Mechanical Engineering, National Sun Yat-Sen University, Taiwan;(6) Department of Electrical Engineering, Fortune Institute of Technology, Taiwan |
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| Abstract: | With the increasing application of flip-chip technology in the microelectronics industry, the adhesion strength of interfaces
in flip-chip microelectronic structures has become an important issue for manufacturing and operation. In this paper we present
an experimental investigation of the adhesive strength of underfill material to solder mask coated FR-4 substrate under thermal
cycling. The effects of the number of thermal cycles on interfacial strength were investigated by using the button shear test.
The relationship between interfacial strength and the thickness of solder mask was also examined. Furthermore, the morphologies
of fracture surfaces of the test specimens were analyzed by scanning electron microscopy. The results of this study show that
the interfacial strength of the underfill/solder mask/substrate joint was significantly reduced by thermal fatigue. Finally,
the degradation behavior and possible mechanisms were then determined on the basis of these observations. |
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| Keywords: | Underfill solder mask adhesion thermal cycle button shear test |
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