首页 | 本学科首页   官方微博 | 高级检索  
     检索      


Crack propagation in a functionally graded plate under thermal shock
Authors:T Fujimoto  N Noda
Institution:(1) Department of Mechanical Engineering, Faculty of Engineering, Shizuoka University, Hamamatsu, Shizuoka, 432-8561, Japan, JP
Abstract:Summary Thermal cracking in a ceramic/metal functionally graded plate is discussed. When a functionally graded plate is cooled from high temperature, curved or straight crack paths are experimentally observed on the ceramic surface. One of the reasons that make the crack paths to differ are the thermal or mechanical conditions. In order to clarify the influence of these conditions on the crack path, the crack propagation is simulated using finite element method. Received 29 September 1998; accepted for publication 2 August 1999
Keywords:Curved crack  compositional profile  thermal shock  functionally graded material  finite element method
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号