CPU散热片温度场模拟分析及其材料和尺寸选择的研究 |
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引用本文: | 王宏伟,葛增杰,顾元宪,杨文彬.CPU散热片温度场模拟分析及其材料和尺寸选择的研究[J].计算力学学报,2003,20(6):725-729. |
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作者姓名: | 王宏伟 葛增杰 顾元宪 杨文彬 |
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作者单位: | 大连理工大学,工业装备结构分析国家重点实验室,大连,116023 |
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基金项目: | 国家自然科学基金重点项目(10032030)资助项目. |
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摘 要: | 对CPU的Cu—Al散热片进行了数值模拟热分析,研究了在室温、强迫对流的条件下的温度分布及散热片材料和几何尺寸对其传热性能的影响,并计算出模块较佳的材料和尺寸参数。有限元数值模拟分析值与实验测试值的比较结果表明,采用有限元热分析技术对CPU散热片进行数值模拟是可行的,为CPU散热片的设计提供了有效的方法。
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关 键 词: | CPU散热片 温度场模拟 强迫对流 传热性能 有限元分析 计算机科学 |
文章编号: | 1007-4708(2003)06-0725-05 |
修稿时间: | 2002年9月16日 |
Simulation of Heat transfer in the CPU ribbed radiator and selection for material and size for the radiator |
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Abstract: | The numerical analysis of heat transfer in the Cu-Al ribbed radiator of CPU is completed in this paper. The temperature distribution of the radiator in the condition of the room temperature, forced convection and influence of the radiator material, and size on heat transfer are studied. The optimal material and size of radiator are computed. The results of comparison between the numerical values of finite element simulation analysis and experimental data show that the finite element simulation of heat transfer in CPU ribbed radiator is feasible, and an effective method is provided for design of CPU ribbed radiator. |
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Keywords: | finite element thermal analysis CPU ribbed radiator |
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