| 热循环加载条件下空洞对EBGA焊点可靠性的影响 |
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| 引用本文： | 褚卫华,陈循,陶俊勇,王考.热循环加载条件下空洞对EBGA焊点可靠性的影响[J].计算力学学报,2005,22(1):119-123. |
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| 作者姓名： | 褚卫华 陈循 陶俊勇 王考 |
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| 作者单位： | 国防科技大学,机电工程与自动化学院机电工程研究所,湖南,长沙,410073 |
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| 摘 要： | 空洞是球栅阵列(BGA：Ball Grid Array)器件在装配过程中形成的主要缺陷之一，本文以增强性BGA(EBGA：Enhanced BGA)为研究对象，采用统一型粘塑性Anand本构方程描述Sn63Pb37的粘塑性力学行为，应用非线性有限元的方法分析了不同位置和大小的空洞对焊点疲劳寿命的影响，为制定装配后的BGA焊点接收标准提供理论参考。
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| 关 键 词： | 焊点 空洞 热疲劳寿命 非线性有限元分析 粘塑性 |
| 文章编号： | 1007-4708(2005)01-0119-05 |
| 修稿时间： | 2003年4月2日 |
Effect of voids on the reliability of EBGA solder joints under thermal cycle |
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| CHU Wei-hu,CHEN Xun,TAO Jun-yong,WANG Kao.Effect of voids on the reliability of EBGA solder joints under thermal cycle[J].Chinese Journal of Computational Mechanics,2005,22(1):119-123. |
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| Authors: | CHU Wei-hu CHEN Xun TAO Jun-yong WANG Kao |
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| Institution: | CHU Wei-hu,CHEN Xun~,TAO Jun-yong,WANG Kao |
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| Abstract: | Voids in BGA (Ball Grid Array) solder joints have been considered as a main defect in assembly. By taken the EBGA (Enhanced-BGA) solder joints as an example in this paper, the unified viscoplastic Anand constitutive equation has been employed to represent the viscoplastic deformation behavior and nonlinear finite element method has been applied to study the effect of size, location of voids on the fatigue life of solder joints, therefore the theoretical reference to establishing the inspection criteria of voids in BGA solder joints has been supplied. |
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| Keywords: | solder joint void thermal fatigue life nonlinear finite element analysis viscoplasticity |
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