电子散斑干涉法在研究双材料界面力学行为中的应用

对于复合材料，界面往往是重要的组成部分，也是缺陷极易发生甚至断裂破坏的地方，从而影响材料整体的力学行为。为了考察不同界面缺陷形式以及材料层厚对界面力学行为的影响，应用电子散斑干涉法对金属基上烤瓷的双材料试件进行了实验研究，部分试件与云纹干涉法结果也进行了比较。实验结果表明具有垂直界面裂纹的试件梁抵抗破坏能力大大削弱，而界面处无缺陷的力学性能较好，其中又以金属层与烤瓷层厚比在3附近的较为理想，实验也表明电子散斑干涉法适用于测量绝对或相对微小的位移，灵敏度达到微米级。

Study of Bimaterial Interfacial Mechanical Behavior by Electronic Speckle Pattern Interferometry

Interface is usually one of important parts in composite materials, but default or broken is often happened in this place, so that the whole mechanical behavior of composite materials is suffering to destroy. In order to obtain the cause of the influence of interfacial mechanical behavior, different interfacial default shape and layer ratio of bimaterial were studied by electronic speckle pattern interferometry. The experiment results indicate that the ability of resistant fracture is very poor with vertical interfacial crack, but mechanical performance is ideal with no default in interfacial. Simultaneously, the process of experiment shows that ESPI is suitable for measure small displacement.