| 高温下C/SiC复合材料弯曲断裂性能实时测试和微观结构表征分析 |
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| 引用本文： | 陈俊,侣明森,张人发,彭樟保,毛卫国,马青松,方岱宁.高温下C/SiC复合材料弯曲断裂性能实时测试和微观结构表征分析[J].实验力学,2016,31(2):243-252. |
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| 作者姓名： | 陈俊 侣明森 张人发 彭樟保 毛卫国 马青松 方岱宁 |
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| 作者单位： | 1. 湘潭大学材料科学与工程学院,湖南湘潭411105;“薄膜材料及器件”湖南省重点实验室,湘潭大学,湖南湘潭411105;2. 国防科技大学新型陶瓷纤维及其复合材料重点实验室,湖南长沙,410073;3. 北京理工大学,北京,100081 |
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| 基金项目： | 国家自然科学基金(No.11102177)、湖南省自然科学基金杰出青年基金(No.14JJ1020)和国家重大科学仪器设备开发专项(2012YQ030075)资助 |
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| 摘 要： | 采用先驱体浸渍裂解法制备三维编织的C/SiC复合材料,利用自主研发的高温散斑制作技术和改进的三维变形光学测试系统,基于数字图像相关技术测试原理,在高温小尺度下实时表征分析C/SiC复合材料的力学性能。运用X射线衍射和扫描电子显微镜测试分析了材料高温氧化情况、显微组织结构及裂纹扩展情况。研究表明:温度对C/SiC复合材料的性能有很大的影响。随着温度的升高,材料由脆性断裂逐渐转变为韧性断裂;材料的断裂韧性由7.98±0.12MPa·m~(1/2)减小到2.76±0.11MPa·m~(1/2),断裂强度从251.40±2.71MPa减小到86.94±1.82MPa。本文为掌握C/SiC复合材料的高温失效机理提供了一种有效的实验测试技术和方法。
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| 关 键 词： | C/SiC复合材料 数字图像相关技术 断裂测试 1600℃高温环境 |
In-situ Measurements of Bending Fracture Behavior and Microstructure Analysis of C/SiC Composites under High Temperatures |
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| CHEN Jun,SI Ming-sen,ZHANG Ren-f,PENG Zhang-bao,MAO Wei-guo,MA Qing-song and FANG Dai-ning.In-situ Measurements of Bending Fracture Behavior and Microstructure Analysis of C/SiC Composites under High Temperatures[J].Journal of Experimental Mechanics,2016,31(2):243-252. |
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| Authors: | CHEN Jun SI Ming-sen ZHANG Ren-f PENG Zhang-bao MAO Wei-guo MA Qing-song and FANG Dai-ning |
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| Institution: | 1.School of Materials Science and Engineering, Xiangtan University, Hunan 411105, China; 2.Key Laboratory of Film Materials and Devices of Science and Technology Department of Hunan Province, Xiangtan University, Hunan 411105, China;1.School of Materials Science and Engineering, Xiangtan University, Hunan 411105, China; 2.Key Laboratory of Film Materials and Devices of Science and Technology Department of Hunan Province, Xiangtan University, Hunan 411105, China;1.School of Materials Science and Engineering, Xiangtan University, Hunan 411105, China; 2.Key Laboratory of Film Materials and Devices of Science and Technology Department of Hunan Province, Xiangtan University, Hunan 411105, China;1.School of Materials Science and Engineering, Xiangtan University, Hunan 411105, China; 2.Key Laboratory of Film Materials and Devices of Science and Technology Department of Hunan Province, Xiangtan University, Hunan 411105, China;1.School of Materials Science and Engineering, Xiangtan University, Hunan 411105, China; 2.Key Laboratory of Film Materials and Devices of Science and Technology Department of Hunan Province, Xiangtan University, Hunan 411105, China;Science and Technology on Advanced Ceramic Fibres and Composites Laboratory, National University of Defense Technology, Changsha 410073, China;Beijing Institute of Technology, Beijing 100081, China |
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| Abstract: | |
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| Keywords: | C/SiC composites digital image correlation fracture tests high-temperature environment |
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