单搭接胶接接头拉伸剪切性能的数值模拟与实验研究

采用数值模拟和光测技术对单向拉伸载荷作用下单搭接胶接接头中的剪切性能进行分析,研究了不同厚度胶层中切应力的变化规律。用有限元方法(FEM)对不同胶层厚度的试件进行建模,得到了拉伸载荷下胶粘剂中的切应力分布及其统计参数。利用数字图像相关(digitalimage correlation,DIC)方法对试件的变形场进行测量。结果表明,当胶粘剂的厚度较小时,胶粘剂中的切应力的分布统计参数随着其厚度的增加会有显著的变化,但是当厚度超过一定的数值时,统计参数对厚度的变化不再敏感。

Numerical Simulation and Experimental Study of Tensile Shear Performance of Adhesively Bonded Single-Lap Joint

Both numerical simulation and optical experiment were performed to analyze shear strain and stress field of the adhesively bonded region under uniaxial tension. Shear stress evolution was investigated by using adhesive with different thickness. Three-dimensional implicit nonlinear finite element solver Abaqus/Standard was used for modeling the shear stress/strain field of adhesively bonded joints with different adhesive' thickness. The shear stress distribution in adhesive under axial tensile loading was obtained. In addition, the shear strain field was measured by using digital image correlation (DIC). Results show that the distribution of shear strain and stress in adhesively bonded single-lap joint varies significantly with the adhesive thickness increasing; but once the thickness is beyond a critical value, the influence of adhesive thickness on shear stress and strain becomes quite small.