云纹干涉法现场测量技术及其在微电子封装中的应用

本文研制了多功能微观云纹干涉仪系统.该系统可以现场测量电子封装组件热疲劳、热湿耦合、热载荷引起的变形,被应用于电子封装组件的可靠性分析中.由现场云纹干涉技术测得的疲劳寿命与加速热循环实验的结果相吻合.本系统还被应用于铜焊点的断裂行为分析中.实验证明本系统可以测量多层结构材料的应力强度因子、应变能释放率以及位相角.

In-situ Moire Interferometry Technique and ts Applications to Microelectronic Packages

In this study, an in-situ multifunctional micro-moire interferometry system (M3I) was developed. The system can be used to conduct the deformation measurement of electronic packages subjected to thermal/thermal cycling, thermal/moisture, and thermal/mechanical loadings. With the system, the long-term reliability of a plastic ball grid array (BGA) assembly was studied. The fatigue life predicted by the in-situ moire interferometry technique was found to be very close to that obtained from the accelerated thermal cycling (ATC) tests. The system was also employed to investigate the fracture behavior of a copper/solder/copper sandwiched sample. It was found that the system is a useful experimental tool for a multilayer material bonded system for the determination of stress intensity factors (SIFs), strain energy release rate, and phase angle.