软材料粘接结构界面破坏研究综述

软材料已经在软机器人、生物医学及柔性电子等各个领域得到广泛的应用. 实际应用中, 软材料多需要粘附于不同类型的基底上, 与之共同组成工程构件进而实现特定的功能, 粘接界面性能对构件的结构完整性与功能可靠性起着关键性作用. 本文对目前软材料粘接结构界面破坏行为方面的研究进行了系统总结. 首先通过与传统粘接结构的对比, 指出了“软界面”与“软基体”两种软材料粘接结构界面破坏行为的独特性及其物理本质. 接着分别总结了“软界面”与“软基体”两种粘接结构界面破坏行为的实验表征方面的研究成果, 对界面及基体黏弹性耗散对界面破坏机理的影响分别进行了分析. 然后从理论角度, 介绍了针对两种软材料粘接结构界面破坏行为的理论分析方法, 并对已建立的相关理论模型进行了总结. 之后以内聚力模型方法为基础, 介绍了软材料粘接结构界面破坏行为数值模拟方面的相关研究进展. 最后基于已有的研究成果, 提出了目前研究所面临的挑战, 并对可能的软材料粘接结构界面破坏的未来研究方向进行了讨论和展望. 

REVIEW OF INTERFACIAL DEBONDING BEHAVIOR OF ADHESIVE STRUCTURES WITH SOFT MATERIALS

Soft material has been widely used in soft robots, biomedicine, flexible electronics and other fields. In practical applications, soft material generally needs to be adhered to different types of substrate forming adhesive structures to accomplish specific functions. The interfacial performance of the adhesive system plays a key role in structural integrity and functional reliability. In this paper, the research efforts on the interfacial debonding behavior of adhesive structures with soft materials are systematically reviewed and summarized. The adhesive structures with soft materials can be classified into two types: (1) adhesive structures with “soft interface” in which stiff adherends are bonded by soft adhesives owning strong energy dissipative, typically viscoelastic, properties; (2) adhesive structures with “soft adherends” in which one or both of the adherends are significantly energy dissipative. In this paper, firstly, the specific mechanical characteristics and physical nature of the interfacial debonding behavior of the adhesive structures with soft materials are analyzed by comparing with those of the traditional “hard” adhesive structures. Secondly, the experimental characterization of the interfacial debonding behaviors of the adhesive structures with “soft interface” and “soft adherend” are summarized respectively. The effects of viscoelastic dissipative property of the adhesive interface and bulk adherends on the interfacial debonding mechanisms are analyzed respectively. Thirdly, the theoretical analysis methods for the interfacial debonding behavior of the adhesive structures with soft materials are reviewed and the relative theoretical models are summarized. Fourthly, the research progress of the numerical simulation, mainly based on the cohesive zone model (CZM) method, of the interfacial debonding behavior of the adhesive structures with soft materials is reviewed. Finally, based on the existing research progress, the challenges of the current research are put forward and the prospect of possible future research opportunities on the interfacial debonding behavior of adhesive structures with soft materials is discussed.