| 圆片冲击法测定硅片抗弯强度的研究 |
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| 引用本文： | 谢书银,石志仪.圆片冲击法测定硅片抗弯强度的研究[J].力学学报,1995,27(3):380-384. |
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| 作者姓名： | 谢书银 石志仪 |
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| 作者单位： | 中南工业大学应用物理系 |
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| 摘 要： | 提出了一种新的使用圆片试样及冲击加载的硅片抗弯强度测试方法，结合动能定理和薄板小挠度理论推导了抗弯强度的计算公式，测试结果准确，精度好。
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| 关 键 词： | 抗弯强度 硅片 冲击载荷 弯曲试验 脆性材料 |
INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD |
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| XieShuyin,ShiZhiyi.INVESTIGATION ON MEASURING FLEXURE STRENGTH OF SILICON WAFER BY WAFER IMPACT METHOD[J].chinese journal of theoretical and applied mechanics,1995,27(3):380-384. |
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| Authors: | XieShuyin ShiZhiyi |
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| Abstract: | A test method for measuring flexure strength of silicon wafer is investigatedwhich adopts circular wafer sample and impact loading.Combining kinetic energy theoremand small deflection sheet theory,We derive the formula calculating flexure strength.Theaccuracy is satisfactory. |
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| Keywords: | flexure strengtht silicon wafer impact loading sheet small deflection |
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