| SnAgCu焊料的动态力学性能 |
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| 引用本文： | 罗斌强,胡时胜.SnAgCu焊料的动态力学性能[J].爆炸与冲击,2009,29(5):542-545. |
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| 作者姓名： | 罗斌强 胡时胜 |
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| 作者单位： | 1.中国科学技术大学中国科学院材料力学行为和设计重点实验室,安徽 合肥 230026； |
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| 摘 要： | 对SnAgCu焊锡材料在应变率0.001、600、1 200、1 800 s-1下的拉伸和压缩力学性能进行了测试，得到了不同应变率下的应力应变曲线。结果表明，该材料不仅具有明显的应变率效应，而且其动、静态的塑性硬化模量差异很大。金相分析显示:准静态压缩时，塑性变形主要由晶粒的转动、变形和晶界的滑移控制；而动态压缩时，可观察到材料内部的枝状晶粒被折断为大量次级晶枝，呈现出明显不同于准静态情况下的变形机制。
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| 关 键 词： | 爆炸力学 动态力学性能 Hopkinson杆 焊锡材料 应变率效应 金相分析 |
Dynamic mechanical properties of SnAgCu solder |
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| LUO Bin-qiang,HU Shi-sheng.Dynamic mechanical properties of SnAgCu solder[J].Explosion and Shock Waves,2009,29(5):542-545. |
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| Authors: | LUO Bin-qiang HU Shi-sheng |
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| Institution: | 1.CAS Key Laboratory for Mechanical Behavior and Design of Materials, University of Science and Technology of China, Hefei 230026, Anhui, China;2.Institute of Fluid Physics, China Academy of Engineering Physics, Mainyang 621900, Sichuan, China |
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| Abstract: | The split Hopkinson bar technique and the material test system were applied to explore experimentally the mechanical properties of SnAgCu solder at room temperature.The stress-strain curves obtained at different strain rates indicate that SnAgCu solder exhibits a strong strain-rate effect and its plastic hardening moduli have great difference under quasi-static and impact loads.Metallographic analysis shows that the plastic deformation in SnAgCu solder under quasi-static compression is governed by the rotat... |
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| Keywords: | mechanics of explosion dynamic mechanical property Hopkinson bar SnAgCu solder strain rate effect metallographic analysis |
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