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| 低温沉积Ag-Cu薄膜的耐原子氧和摩擦学性能 | |
| 引用本文： | 高晓明,孙嘉奕,胡明,翁立军,伏彦龙,杨军,谭洪根,张良俊.低温沉积Ag-Cu薄膜的耐原子氧和摩擦学性能[J].摩擦学学报,2013,33(3):245-252. |
| 作者姓名： | 高晓明 孙嘉奕 胡明 翁立军 伏彦龙 杨军 谭洪根 张良俊 |
| 作者单位： | 1. 上海市空间飞行器机构重点实验室,上海201108;中国科学院兰州化学物理研究所固体润滑国家重点实验室,甘肃兰州730000 2. 中国科学院兰州化学物理研究所固体润滑国家重点实验室,甘肃兰州,730000 3. 上海市空间飞行器机构重点实验室,上海,201108 |
| 基金项目： | 国家自然科学基金项目(50301015,51227804))资助. |
| 摘 要： | 采用多弧离子镀在低温(173 K)沉积了Ag-Cu薄膜,通过地面原子氧模拟试验机构考察了薄膜的耐原子氧性能,通过X射线衍射(XRD)、原子力显微镜(AFM)和球-盘摩擦试验机对薄膜结构、耐原子氧性能和摩擦学性能进行了表征,并与室温(300 K)及低温(173 K)沉积Ag薄膜进行了比较研究.结果表明:低温沉积Ag-Cu薄膜由面心立方结构的AgCu合金相和少量Ag或Cu组成,Cu元素合金和低温沉积可细化Ag薄膜的晶畴尺寸、提高其致密性,细密的薄膜结构有利于抑制原子氧对薄膜的攻击,因此低温沉积的Ag-Cu薄膜表现出较好的耐原子氧性能；磨损试验结果表明低温沉积的Ag-Cu薄膜表现出较好的耐磨性,这主要归因于其细密的薄膜结构和较高的膜-基结合强度,此外由于其耐原子氧性能的改善,低温沉积Ag-Cu薄膜在原子氧辐照前后磨损率的增加明显低于低温和室温沉积Ag薄膜. |
| 关 键 词： | 低温沉积 Ag-Cu薄膜 耐原子氧性能 摩擦学性能 |
Atomic Oxygen Resistant and Wear Behavior of Ag-Cu Films Deposited at a Low Temperature |
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| GAO Xiao-ming,SUN Jia-yi,HU Ming,WENG Li-jun,FU Yan-long,YANG Jun,TAN Hong-gen and ZHANG Liang-jun.Atomic Oxygen Resistant and Wear Behavior of Ag-Cu Films Deposited at a Low Temperature[J].Tribology,2013,33(3):245-252. | |
| Authors: | GAO Xiao-ming SUN Jia-yi HU Ming WENG Li-jun FU Yan-long YANG Jun TAN Hong-gen and ZHANG Liang-jun |
| Institution: | 1. Shanghai Key Laboratory of Spacecraft Mechanisms, Shanghai 201108, China;2. State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;State Key Laboratory of Solid Lubrication, Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences, Lanzhou 730000, China;Shanghai Key Laboratory of Spacecraft Mechanisms, Shanghai 201108, China;Shanghai Key Laboratory of Spacecraft Mechanisms, Shanghai 201108, China |
| Abstract: | Ag-Cu films were deposited at a low temperature (173 K, LT-Ag-Cu films) by arc ion plating. Atomic oxygen (AO) irradiation experiments were conducted using a ground AO simulation facility. The AO resistant and wear behavior of the LT-Ag-Cu films were investigated by X-ray diffraction, atomic force microscope and a ball-on-disk tribometer using Ag film deposited at room temperature (300 K, RT-Ag film) as a reference. The results show that the LT-Ag-Cu films were composed of AgCu alloy and small amount of Ag or Cu. Because of densified microstructure, lower crystallite size and alloying with Cu, the LT-Ag-Cu film represented much better anti-oxidation capability under the AO irradiation condition than that of the RT- and LT-Ag films. Wear results show that as compared with the RT-Ag film, the LT-Ag-Cu films exhibited much better wear resistance due to the better film-substrate adhesion as well as the fine/dense structure, and the wear increase resulted from the AO irradiation was much lower for the LT-Ag-Cu films than the RT- and LT-Ag film due to the improvement in the AO resistant behavior. |
| Keywords: | low temperature deposition Ag-Cu films AO resistant behavior wear |
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