基底纹理对镍/铜纳米双层膜刮擦行为影响的分子动力学模拟

采用分子动力学模拟研究纳米尺度下的镍/铜双层膜的表面刮擦响应. 考虑基底铜膜材料的不同表面纹理，建立分子动力学模拟模型，分析了纳米双层膜不同基底纹理下的刮擦响应，并且对比了两种典型基底纹理下不同刮头半径、不同刮擦深度对纳米双层膜刮擦响应的影响. 研究结果发现:不同的基底纹理下，位错缺陷程度的不同会导致刮头前方的切屑体积不同，存在切屑体积最大的基底纹理；针对两种典型基底纹理，在刮擦深度或刮头半径一定时，刮擦力随刮头半径或刮擦深度的增加而增大；当刮擦深度或刮头半径超过临界值时，表面具有特定齿槽纹理的基底具有一定的减摩作用. 

Molecular Dynamics Simulation of Substrate Texture’s Effect on Nano-Scratch of Nickel/Copper Bilayer Film

The nano-scratch response of the nickel/copper bilayer film was studied with molecular dynamics simulation. The scratch response of the nano-nickel/copper bilayer film under different substrate textures was analyzed. The effects of tip radius and scratch depth on the scratch response of the nano-nickel/copper bilayer film were also investigated. The results showed that the extent of dislocation, due to different substrate textures, resulted in different chip sizes in front of the scratch tip. The smooth substrate surface brought to the largest chip volume. For two typical substrate textures, the scratch forces increased with the increase of the tip radius or the scratch depth when another kept constant. Moreover, when the tip radius or the scratch depth reached certain level, the substrate surface with groove texture showed certain anti-friction effect.