| 纯铅化学机械抛光中工艺参数对抛光性能的影响 |
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| 引用本文： | 蔡荣,余家欣,王超.纯铅化学机械抛光中工艺参数对抛光性能的影响[J].摩擦学学报,2020,40(5):559-568. |
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| 作者姓名： | 蔡荣 余家欣 王超 |
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| 作者单位： | 1.西南科技大学 制造过程测试技术教育部重点实验室，四川 绵阳 621010 |
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| 基金项目： | 国家自然科学基金项目(51975492，51575462)，四川省科技厅重大前沿科学技术研究项目(2018JY0245)和四川省教育厅科研重点项目(18ZA0504)资助 |
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| 摘 要： | 为获得高质量纯铅表面，采用化学机械抛光(CMP)的方法并辅以自制抛光液，研究了胶体二氧化硅抛光颗粒的形状、粒径和浓度、加载压力、抛光头与抛光盘转向和转速、抛光液流量等工艺参数对铅片表面材料去除率和粗糙度的影响. 研究表明:小粒径异形(眉形)胶体二氧化硅抛光颗粒相较于大粒径球形颗粒更有利于铅片抛光，抛光颗粒的粒径和浓度对纯铅抛光性能的影响主要取决于铅片表面与胶体二氧化硅颗粒以及抛光垫表面丝绒的耦合作用关系. 随着加载压力、抛光头与抛光盘转向和转速、抛光液流量的改变，铅片表面和抛光垫之间驻留的层间抛光液的厚度以及状态发生改变，从而直接影响抛光液的流动性、润滑性和分散性，以及影响抛光颗粒和化学试剂与铅片表面的机械化学作用，进而影响抛光质量和材料去除率. 通过对工艺参数影响的研究和对工艺参数的优化，最终获得了表面粗糙度Ra为1.5 nm的较为理想的超光滑纯铅表面，同时材料去除率能够达到适中的380 ?/min.
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| 关 键 词： | 铅 化学机械抛光 工艺参数 材料去除率 表面粗糙度 |
| 收稿时间： | 2019-11-20 |
Effect of Process Parameters on Polishing Performance of Pure Lead During Chemical Mechanical Polishing |
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| Institution: | 1.Key Laboratory of Testing Technology for Manufacturing Process, Ministry of Education, Southwest University of Science and Technology, Sichuan Mianyang 621010, China2.Institute of Mechanical Manufacturing Technology, China Academy of Engineering Physics, Sichuan Mianyang 621900, China |
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| Abstract: | In order to obtain high-quality pure lead surface, based on self-made polishing slurries, the influence of shape, particle size and concentration of colloidal silica polishing particles, as well as down force, the rotation speed and direction of polishing head / disc and the slurry flow rate on the surface material removal rate and roughness of lead sheet were investigated by chemical mechanical polishing (CMP). The results revealed that, compared with the larger spherical colloidal silica polishing particles, the smaller particle with brow-shaped were more beneficial to the polishing of lead sheet. The influence of particle size and concentration of polishing particles on the polishing performance of pure lead mainly depended on the coupling relationship among lead sheet surface, colloidal silica particles and the lint on polishing pad surface. With the change of down force, the rotation speed and direction of polishing head / disc as well as the slurry flow rate, the thickness and status of polishing slurries varied at the lead sheet / polishing pad interface, which directly affected the fluidity, lubricity and dispersion of polishing slurries and the chemical-mechanical interaction between polishing particles, chemical reagent and lead sheet surface, thereby affecting the polishing quality and the material removal rate. By the investigation of the influence of process parameters and parameters optimization, this work finally obtained an ideal ultra-smooth pure lead surface with surface roughness of Ra 1.5 nm and the material removal rate of 380 ?/min. |
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