HL-2M 真空室保温层设计及安装

基于 HL-2M 真空室烘烤保温要求，通过有限元分析和原型件实验确定采用陶瓷纤维与纳米级微孔材 料组合作为 HL-2M 真空室保温材料。在 30℃时，保温层的导热系数小于 0.027W?m^?1·℃^?1；300℃时，导热系数 小于 0.038W?m^?1·℃^?1。在保温层厚度 25mm、热面温度 300℃且达到稳态时，冷面可控制在 85℃以下，线圈侧的 温度低于 60℃，整体热损失小于 12kW，满足 HL-2M 真空室烘烤需求。 

Design and assembly process for the thermal insulationof the HL-2M vacuum vessel

Based on the requirements of HL-2M baking insulation requirement, it was determined that  ceramic fiber and nanoscale microporous material were used as insulation material for HL-2M vacuum vessel  through finite element analysis and prototype test. It is found that the thermal conductivity of the insulation layer  is less than 0.027W?m?1·℃^?1 at 30℃ and less than 0.038W?m^?1·℃^?1 at 300℃. For the chosen insulation layer of  25mm thick, when the temperature of the hot surface is 300℃ and reaches a steady state, the cold surface can be  controlled below 85℃, the temperature of the coil side is lower than 60℃, and the overall heat loss is less than  12kW, which meets the baking requirements of the HL-2M vacuum vessel.