ITER第一壁实验件的铍-铜连接界面分析

在ITER第一壁实验件的研究中，采用热等静压扩散连接技术对Be与CuCrZr合金进行连接实验，对完成扩散连接的部分连接件采用退火处理。对所有连接件进行超声波无损探伤后，检测到未退火的连接件Be/Cu连接界面存在缺陷。为分析扩散界面缺陷产生原因，从连接件的无缺陷区取样并进行界面微观分析。通过观察微观形貌和分析界面扩散层合金元素的变化，发现退火处理过的Be-Cu扩散界面的Cu-Ti扩散层和未扩散的Ti层厚度增加，中间层中Be与Cu元素形成脆性相的几率降低，整个扩散层厚度变大，扩散范围加大。实验表明退火工艺能改变Be/Cu热等静压扩散层连接结构组成，扩大扩散连接范围。

Thermal stress and elastic-plastic structural analysis of the ITER first wall beryllium-copper interface defects

In order to guarantee the performance of the first wall beryllium copper connection under the ITER operation, the high heat flux test (HHFT) should be taken to evaluate the effects of defects, and then determine the acceptable defect size. Aiming at such test, using enhanced heat load (EHF) first wall small module, the temperature field and elastic-plastic structural analysis have been taken to study the effects of Be/CuCrZr interface defects under the high heat flux test condition. Analysis results show that the location and the size of Be/CuCrZr interface defects have a direct impact on local elastic-plastic strain, which affects thermal fatigue performance of the module; the bigger the defects, the greater the influence; marginal type defects is greater than the influence of the center type defects.