Lattice location of light implanted ions in Si and Ge after laser annealing

Abstract

Radiation damage produced by short ranged (ranges 20–30 μm) charged particles (alpha particles and fission fragments) in thick plastic track detectors (thickness ≈ 150 μm) has been enlarged to produce “through” holes by using a combination of electrochemical and chemical etching processes. A series of experiments were conducted with a view to optimize the operating conditions required to produce through holes with most suitable profiles for a particular application at hand. This novel technique has been employed in producing thick nuclear track filters using fission fragments from U-235 fission and alpha particles from radon and its daughters.