实时激光三维成像焦平面阵列研究进展

研究了应用于实时激光三维成像的焦平面阵列技术,介绍了目前国际上几种常用的焦平面阵列实现原理与技术特点,并对其优点与不足进行了分析,同时对表征焦平面阵列的主要性能指标以及其对最终成像系统的影响进行了定性分析。根据对现有技术的对比分析,提出基于雪崩光电二极管（APD）阵列和读出电路（ROIC）集成的探测器方案在灵敏度和作用距离等方面具有一定优势,是实现实时三维成像焦平面阵列较为理想的技术。作者认为在未来十几年内,激光三维成像焦平面阵列规模有望超过1 024 pixel×1 024 pixel,像元尺寸可降低到15μm。

Research progress in focal plane array for real-time laser three dimensional imaging

In this article, we introduce several main Focal Plane Array （FPA） structures used nowadays and try to find their advantages and shortcomings. Several main parameters used to describe the performance of FPA and their influences on system performance FPA technologies, and a Read-out In it suggests that the integrated are described. On the analysis and comparison for existing detecting scheme based on a Avalanche Photodiode （APD） tegrated Circuit（ROIC） will be an ideal real-time three dimensional imaging technology due to its advantages in sensitivity and operation ranges. It also indicates that in the near future, the scale of FPA can exceed 1 024 pixel × 1 024 pixel with a pixel pitch of 15 μm.