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电致发光的完全悬空超薄硅衬底氮化镓基蓝光LED器件的制备与表征
引用本文:蒋成伟,沙源清,袁佳磊,王永进,李欣.电致发光的完全悬空超薄硅衬底氮化镓基蓝光LED器件的制备与表征[J].中国光学,2021(1).
作者姓名:蒋成伟  沙源清  袁佳磊  王永进  李欣
作者单位:南京邮电大学通信与信息工程学院
基金项目:中国博士后基金(No.2018M640508);江苏省高校自然科学基金(No.18KJB510025);南京邮电大学1311人才计划;南京邮电大学国自孵化基金(No.NY218013)。
摘    要:为提升硅衬底氮化镓基LED(发光二极管)器件的光电性能和出光效率,本文提出了一种利用背后工艺实现的悬空薄膜蓝光LED器件。结合光刻工艺、深反应离子刻蚀和电感耦合等离子体反应离子刻蚀的背后工艺,制备了发光区域和大部分正负电极区域的硅衬底完全掏空,并减薄大部分氮化镓外延层的悬空薄膜LED器件。对悬空薄膜LED器件进行三维形貌表征,发现LED悬空薄膜表面平坦,变形程度小,证明背后工艺很好地解决了氮化镓外延层和硅衬底之间由于应力释放造成的薄膜变形问题。表征了LED器件的电流电压曲线和电致发光光谱等光电特性,对不同结构、不同发光区域尺寸的LED器件进行对比,发现悬空薄膜LED器件的光电性能和出光效率比普通LED器件更优越,且发光区尺寸变化对LED器件性能的影响更明显。在15 V驱动电压下,与普通LED器件相比,发光区直径为80μm的悬空LED器件的电流从4.3 mA提升至23.9 mA。在3 mA电流的驱动下,峰值光强提升了约5倍,而发光区直径为120μm的悬空器件与发光区直径为80μm的悬空器件相比,出光效率提升更为明显。本研究为发展高性能悬空氮化物薄膜LED器件提供了更多可能性。

关 键 词:氮化镓  发光二极管  悬空薄膜  背后工艺  电致发光

Fabrication and characterization of an LED based on a GaN-on-silicon platform with an ultra-thin freestanding membrane in the blue range
JIANG Cheng-wei,SHA Yuan-qing,YUAN Jia-lei,WANG Yong-jin,LI Xin.Fabrication and characterization of an LED based on a GaN-on-silicon platform with an ultra-thin freestanding membrane in the blue range[J].Chinese Optics,2021(1).
Authors:JIANG Cheng-wei  SHA Yuan-qing  YUAN Jia-lei  WANG Yong-jin  LI Xin
Institution:(College of Telecommunications and Information,Nanjing University of Posts and Telecommunications,Nanjing 210003,China)
Abstract:In order to improve the opto-electronic performance and light extraction efficiency of LEDs based on a GaN-on-silicon platform,we proposed an LED device based on GaN-on-silicon with an ultra-thin freestanding membrane.By combining photolithography,deep reactive ion etching and inductively-coupled plasma reactive ion etching,we prepared an LED based on a GaN-on-silicon platform with an ultra-thin freestanding membrane,removing the silicon substrate of light-emitting area and most area of the electrodes,and thinning most of the GaN epitaxial layer.We performed three-dimensional morphology characterization for the LED device and found that the surface of the LED’s membrane is flat and that the membrane’s deformation is minimal.It is proved that the back process can solve the problem of membrane deformation caused by stress release between the GaN epitaxial layer and the silicon substrate.By characterizing the current-voltage and electroluminescence spectrum of the LED and comparing the LEDs with different structures and different light-emitting area sizes,we found that the opto-electronic performance and light output efficiency of the LED with an ultra-thin freestanding membrane are better than that of the common LED,and the change in size of the light-emitting area has a significant effect on the performance of the LED.Compared with the current of common LED,the current of the LED which has an ultra-thin freestanding membrane with 80-μm diameter light-emitting area increased from 4.3 mA to 23.9 mA under 15 V driving voltage.Under 3-mA current,the peak light intensity increased by about 5 times.The light-emitting efficiency of the LED with a 120-μm diameter light-emitting area is improved more perceptibly compared with that of LED with a 80-μm diameter light-emitting area.This research provides more possibilities for the development of high-performance LED devices with an ultra-thin freestanding membrane.
Keywords:gallium nitride  LED  freestanding membrane  back process  electroluminescence
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