双波段芯片集成封装组件的低温光谱定量化

在同一组件中多芯片多波段的应用中,由于芯片的中心距越来越小,导致某些相邻波段通常被集成制备到一个芯片上。为减小波段串扰,本文针对一体化双波段芯片集成封装组件的低温光谱定量化展开研究,通过制备一体化双波段芯片集成封装组件,并通过波段间物理隔离、金属区物理遮盖等措施将两波段的光束隔离。测试结果表明隔离前后,芯片间光谱串光现象有了明显改善,波段间串扰从8%降到了4%以内,光谱带外响应从6.5%降低至0.78%。为了避免低温工况下物理隔离条与芯片的热失配问题,隔离条采用与芯片衬底完全一致材料。双波段芯片集成封装组件的高低温冲击试验表明,其在有效抑制组件内串扰的同时,也解决了组件内关键部件的热失配问题。

Low temperature spectroscopy quantification of integrated dual band chip package

As the chip center distance becomes smaller and smaller, some adjacent bands are usually integrated and prepared on a single chip in multi-chip and multi-band applications of the same component. Therefore, the crosstalk between the chips and the reflection of the chip metal film area will have some impact on the spectral characteristics. In order to reduce the influence of band crosstalk, this paper studies the low-temperature quantificational spectrum control of integrated dual-band chip package. By preparing integrated dual-band chip package, two-band beam isolation is achieved through physical isolation between wavebands and physical cover of the metal areas. The test results show that the spectral crosstalk between chips has been significantly improved after isolation. The crosstalk between bands has been reduced from 8% to 4%, and the out-of-band response has been reduced from 6.5% to 0.78%. In order to avoid the problem of thermal mismatch between the physical isolation strip and the chip under the condition of low temperature, the isolation strip adopts the material which is completely consistent with that of the chip substrate. High-low temperature impact test of dual-band chip package shows that the thermal mismatch of the key components in the package can be solved while effectively suppressing the crosstalk in the package.