基于彩色图像分割技术的SMT焊点质量检测

图像分割的策略和方法是SMT焊点图像处理的一项关键技术,也一直是SMT焊点计算机质量检测的瓶颈;以SMT焊点的颜色和几何特征作为分析对象,在灰度图像分割所用二维阈值化的分割方法的基础上,提出一种从颜色直方图的量化级数和二维直方图概率密度不均匀化两个方面改进后的适用于HSV彩色空间图像分割技术,并将其应用于SMT焊点的质量检测;通过其得到SMT片式元器件焊点的图像,对其进行形态学处理后,利用Matlab软件将SMT焊点成功地从PCB板上分离出来,为三维重建提供良好的基础。

Study on Detection Method Based on Color Image Segmentation for SMT Solder Joints

Image segmentation strategies and methods of SMT solder image processing is a key technology,and a bottleneck in the SMT solder computer vision inspection.This paper proposes the improvement method of image segmentation about HSV color spatial based on color and geometric feature of SMT solder joints.The improvement method is applied in the SMT solder quality examination.The image of SMT solder joints is segmented using the improved 2D-threshold method of segmentation and morphologic and it can be separated from the image of PCB with Matlab.It provides a good basis for the subsequent 3D reconstruction.