Influence of copper solute on the creep rate sensitivities of aluminium

The presence of copper atoms as continuous networks at the grain boundaries of an aluminium-copper alloy has been considered not preventing the moving of dislocations during creep (or at least partially). The dislocations can bs absorbed by these boundaries and penetrate through them. That leads to changés of shape and structure of grains and also to the sliding of grains against each other. This was deduced from the accelerating increase in the sensitivity of the steady state creep rate to the applied stress of an aluminium 2·8 wt% copper alloy examined at wide range of temperatures (50–350 °C) and applied stresses (7–170 MPa). This rapid increase in the sensitivity parameter of the steady state creep rate occurs in Al-Cu alloys at quite higher ranges of applied stresses and may be attributed mainly to the contribution of the grain boundary movements to the creep strain.