多芯片半导体激光器光纤耦合设计

应用ZEMAX光学设计软件模拟了一种多芯片半导体激光器光纤耦合模块,将12支808nm单芯片半导体激光器输出光束耦合进数值孔径0.22、纤芯直径105μm的光纤中,每支半导体激光器功率10 W,光纤输出端面功率达到116.84W,光纤耦合效率达到97.36%,亮度达到8.88MW/(cm2·sr)。通过ZEMAX和ORIGIN软件分析了光纤对接出现误差以及单芯片半导体激光器安装出现误差时对光纤耦合效率的影响,得出误差对光纤耦合效率影响的严重程度从大到小分别为垂轴误差、轴向误差、角向误差。

Fiber coupling analysis of multi-chip laser diodes

Using ZEMAX optical design software to simulate a multi-chip laser diode fiber coupling module, 12 single-chip laser diodes with wavelength of 808 nm being coupled into the core diameter of output fiber which is set as 105 microns with a numerical aperture of 0.22, each single-chip laser diode has an output power of 10 W, the fiber end face will have an output power of 116.84 W with a coupling efficiency of 97.36% and a brightness of 8.88 MW/(cm2sr). Finally, optical fiber and single-chip semiconductor laser installation error on the influence of the fiber coupling efficiency is analyzed using ZEMAX and ORIGIN software. It is concluded that the severity of the error influence on the optical coupling efficiency from heavy to light: the vertical axis error, the axial error, the angle error.