双壳层靶丸金属层电沉积装置设计

设计了一种新型双壳层靶丸金属层电沉积装置,借助计算机模拟了其设计原理,分析了微球的运动及镀层的生长模式,介绍了其各部分结构和功能。借助理论计算,确定了镀槽的整体尺寸,其中槽体半径确定为5cm。镀槽的特殊结构使微球上部镀层沉积速度较快,结合小球的自转及围绕圆柱体的公转运动实现镀层均匀沉积。镀液及微球的运动模式使镀液流速合并了主盐浓度、小球平动速度、小球转动速度三个关键参数,简化了对沉积过程的控制。在新旧装置上进行了电沉积实验,制备出了镀层厚度分别为9μm和2μm的空心金微球,结果表明:使用设计的装置可制备表面质量良好、厚度均匀且可控的金属微球,镀层厚度由沉积时间、金属层密度、镀液比重、微球芯轴的等效密度等决定。

Design of electroplating device for double-shell targets

A device is designed to deposit metals on double-shell targets. The plating mechanism is described in detail, as well as structure and function. The special structure of the tank make the growing speed of upper surface faster than that of the lower. Rotation and revolution of the micro spheres make the deposit grow uniformly. The special flow pattern of plating bath reduces the number of parameters, and make the process easy to control. Determinants of layer thickness and uniformity were researched. The results show that the new plating tank has a better performance than the old one. Layer thickness is determined by depositing time, metal density, solution density, equivalent density of the micro spheres.