| 高平均功率面阵二极管激光器散热分析 |
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| 引用本文： | 武德勇,严地勇,唐淳,高松信.高平均功率面阵二极管激光器散热分析[J].强激光与粒子束,2001,13(5):537-540. |
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| 作者姓名： | 武德勇 严地勇 唐淳 高松信 |
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| 作者单位： | 中国工程物理研究院 应用电子学研究所， 四川 绵阳 621900 |
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| 基金项目： | 国防科技基础研究基金资助课题 (0 0 3 0 2 ) |
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| 摘 要： | 采用三维有限元法分析了面阵二极管激光器背冷式封装结构的散热效率，对次热沉厚度，冷却器结构参数进行了优化设计，计算结果表明，优化设计后的封装结构，可满足面功率密度为500W/cm2，占空比为20％的高平均功率面阵二极管激光器的散热要求。
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| 关 键 词： | 二极管激光器 冷却器 热沉 |
| 文章编号： | 1001-4322(2001)05-0537-04 |
| 收稿时间： | 2000/9/11 |
| 修稿时间： | 2000年9月11日 |
Thermal analysis of high average power laser diode arrays |
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| WU De yong,YAN Di yong,TANG Chun,GAO Song xing.Thermal analysis of high average power laser diode arrays[J].High Power Laser and Particle Beams,2001,13(5):537-540. |
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| Authors: | WU De yong YAN Di yong TANG Chun GAO Song xing |
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| Institution: | Institute of Applied Electronics，CAEP，P.O.Box 919-1013，Mianyang 621900，China |
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| Abstract: | In this paper a water cooler for 2D laser diode arrays cooling was presented.The cooler can be manufactured with line cutting method and with very low cost.The thermal resistance of the laser diode with back cooling packaged structure was calculated and the thickness of the submount and the structure of the cooler were optimized by three dimension finite element method.The calculated results indicated that the thickness of submount,the cooling water channel depth and the fin width have optimum values.The lowest thermal impedance of the water cooler was 0.093℃·cm 2/W.The package design can meet the needs of heat dissipating for high power laser diode arrays with power density of 500W/cm 2 and 20% duty cycle. |
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| Keywords: | laser diode cooler heat sink |
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