超细钼丝亚硫酸盐脉冲镀金实验研究

 超细钼丝是Z-pinch物理实验常用的材料之一。采用亚硫酸脉冲镀金技术，在超细钼丝上镀制一层均匀致密的金层来改善钼丝性能。实验研究和优化了影响镀层质量和沉积效率的主要工艺条件，优化后的阴极电流密度2 mA/cm²，溶液pH值8.5，溶液温度40°。用扫描电镜观察镀金钼丝的表面形貌及镀层质量；用划痕法测试了镀层与钼丝表面的结合力。实验结果表明，采用经过优化的镀金工艺能够在直径小于15 μm的钼丝上镀制厚度0.6~2.5 μm的致密金层，且能够有效地降低钼丝表面的粗糙度和提高抗氧化能力，满足Z-pinch实验的需要。

Gilt molybdenum wire for Z-pinch experiment by sulfite pulse gilding technique

The ultra-fine molybdenum wire is often used for Z-pinch experiment. To improve the performance of the molybdenum wire, the sulfite pulse gilding technique was used to plate a compact gold layer on the wire. The technological conditions were optimized to ensure the surface quality of the molybdenum wire, including the cathode current density being 2 mA/cm~2, the pH value of the solution being 8.5, and the temperature of the solution being 40 ℃. The surface of the molybdenum wire was observed by a scan electron microscope. The bind-force between the gold layer and the molybdenum wire was tested with the nick method. The results show that with the optimized technique the molybdenum wire of less than 15 μm in diameter can be plated with a gold layer of 0.6~2.5 μm thick and the gilt molybdenum wire satisfies the requirements of the Z-pinch experiment.