UV assisted oxidation and nitridation of hafnia based thin films for alternate gate dielectric applications

The synergistic effects of NH₃ ambient and ultraviolet illumination on the dielectric properties of hafnia based gate dielectrics are reported in this paper. The films were processed at relatively low temperatures (∼400 °C) by pulsed laser ablation and UV oxidation technique. UV illumination and the NH₃ ambient created a thin and a denser interfacial layer (at the film-Si interface) comprised of HfSiON bonding. As a result of the interfacial layer modification, a leakage current density lower than 10⁻⁴ A/cm² and a dielectric constant of ∼21.7 were extracted from the best samples processed in NH₃ and under UV illumination. The nitrogen doped HfO₂ also exhibited a thinner interfacial layer (∼12 Å) in comparison to the films processed without NH₃ ambient.