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再生冷却红外窗口热响应特性耦合计算研究
引用本文:耿湘人,桂业伟,张来平.再生冷却红外窗口热响应特性耦合计算研究[J].工程热物理学报,2007,28(Z2):73-76.
作者姓名:耿湘人  桂业伟  张来平
作者单位:中国空气动力研究与发展中心,四川,绵阳,621000
基金项目:武器装备预研基金 , 国家重点基础研究发展计划(973计划)
摘    要:本文对强对流加热环境下带再生冷却系统的红外窗口传热和热应力问题进行了数值模拟,采用一维管流假设,管流和固体结构传热采用耦合方式求解.研究表明:(1)在本文计算状态下模型温度和热应力都是随加热时间而增加的,最大温度发生在窗口表面的填充材料和石英玻璃中部,最大热应力发生在合金材料内部;(2)现有冷却管道配置下工质温度没有异常变化;(3)窗口区合金温度一直在升高,若飞行时间进一步延长,要考虑合金温升给窗口防热带来的不利影响;(4)在现有温度分布状态下,内冷管道的引入并未给结构强度造成薄弱环节.

关 键 词:热防护  热传导  热应力  再生冷却
文章编号:0253-231X(2007)Suppl.2-0073-04
修稿时间:2007年1月15日

COUPLED INVESTIGATION ON THERMAL RESPONSE CHARACTE RISTIC OF RE-GENERATIVELY COOLED INFRA-WINDOW
GENG Xiang-Ren,GUI Ye-Wei,ZHANG Lai-Ping.COUPLED INVESTIGATION ON THERMAL RESPONSE CHARACTE RISTIC OF RE-GENERATIVELY COOLED INFRA-WINDOW[J].Journal of Engineering Thermophysics,2007,28(Z2):73-76.
Authors:GENG Xiang-Ren  GUI Ye-Wei  ZHANG Lai-Ping
Abstract:The temperature and thermal stress of a re-generatively cooled infra-window(IR)subjected to strongly convectively heating is numerically simulated.The re-generatively cooled pipe flow is supposed to be quasi one-dimensional,and the heat conduction within the pipe and IR structure is solved in a coupled manner.It is demonstrated that:(1)Under given conditions the IR temperature and thermal stress would increase as time increases.The maximum temperature occurs at the middle part of silica glass on the exterior of IR,while the maximum thermal stress within alloy aluminum at interior of IR.(2)The medium temperature within actively-cooled pipe doesn't show any considerable change.(3)The temperature of alloy aluminum on IR increases constantly.If the flight trajectory is lengthened,the temperature increase may cause the malfunction of the IR heat-shield,which should be paid great attention to.(4)At the flight condition given on the paper,the use of re-generatively cooled pipe doesn't weaken the structure strength of IR.The finer calculation considering thermally non-fully developed effect of pipe-flow needs to be investigated further in the future.
Keywords:heat shield  heat conduction  thermal stress  re-generatively cooled
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