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铜薄膜电子-声子耦合系数的实验研究
引用本文:马维刚,王海东,张兴,过增元.铜薄膜电子-声子耦合系数的实验研究[J].工程热物理学报,2010(3).
作者姓名:马维刚  王海东  张兴  过增元
作者单位:清华大学工程力学系热科学与动力工程教育部重点实验室;
基金项目:国家自然科学基金资助项目(No.50676046;No.50730006)
摘    要:电子元件的超微型化和高集成化,对金属互连线的导热性能提出极高的要求;同时,新型高性能光电材料的开发,又需要尽可能降低受光激发电子与声子之间的耦合。电子、声子的相互作用,对于能量转换与传递过程微观机理的研究至关重要。这些载能粒子的作用时间都在飞秒-皮秒量级,本文采用飞秒激光瞬态热反射方法,对铜薄膜中微观粒子作用过程进行了飞秒量级的实验研究。通过对实验系统精细调节,得到了理想的信号曲线,在此基础上测量了不同泵浦光功率下沉积在硅基底上厚度为60 nm铜薄膜的电子-声子耦合系数,测量结果为(11~12)×10~(16)W/(m~3K),和理论值14×10~(16)W/(m~3K)较为接近,并且不随泵浦光强发生变化。

关 键 词:电子-声子耦合系数  瞬态热反射  飞秒激光  铜薄膜  

EXPERIMENTAL STUDY OF ELECTRON-PHONON COUPLING FACTOR OF COPPER THIN FILM
MA Wei-Gang WANG Hai-Dong ZHANG Xing GUO Zeng-Yuan.EXPERIMENTAL STUDY OF ELECTRON-PHONON COUPLING FACTOR OF COPPER THIN FILM[J].Journal of Engineering Thermophysics,2010(3).
Authors:MA Wei-Gang WANG Hai-Dong ZHANG Xing GUO Zeng-Yuan
Institution:Key Laboratory of Thermal Science and Power Engineering of Ministry of Education;Department of Engineering Mechanics;Tsinghua University;Beijing 100084;China
Abstract:Metallic thin wires are widely used as interconnectors in the ultra-miniature and highly-integrated systems and expected to exhibit high heat conductance.While in the development of novel photoelectric material,the coupling between electrons and phonons should be reduced as much as possible.The electron-phonon coupling is dominant to energy exchange in metals and the interaction time is in the order of femto to picoseconds.In this paper,the electron-phonon coupling factor of a copper nanofilm with thickness...
Keywords:electron-phonon coupling factor  transient thermoreflectance  femtosecond laser  copper thin film  
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