| 电子芯片散热器特性的测试研究 |
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| 引用本文： | 陈希章,刘中良,马重芳,俞坚.电子芯片散热器特性的测试研究[J].工程热物理学报,2004,25(6):995-997. |
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| 作者姓名： | 陈希章 刘中良 马重芳 俞坚 |
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| 作者单位： | 北京工业大学教育部传热强化与过程节能重点实验室及北京市传热与能源利用重点实验室,北京,100022;北京工业大学教育部传热强化与过程节能重点实验室及北京市传热与能源利用重点实验室,北京,100022;北京工业大学教育部传热强化与过程节能重点实验室及北京市传热与能源利用重点实验室,北京,100022;北京工业大学教育部传热强化与过程节能重点实验室及北京市传热与能源利用重点实验室,北京,100022 |
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| 基金项目： | 国家重点基础研究发展规划项目(No.G2000026304) |
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| 摘 要： | 电子芯片散热问题的解决进程直接影响着计算机技术的发展。目前,电子芯片冷却中应用最广泛的仍然是空气散热器。因此,对散热器的性能进行检测非常重要,但缺少统一的标准检测与评价方法。本文采用一个试验装置对两个不同类型的散热器的性能进行测试,并对结果进行整理,分析了散热器的稳态、瞬态下的储热和散热性能。从而探索了标准的散热器性能评价方法及标准的散热器性能测试方式。
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| 关 键 词： | 散热器 模拟芯片 性能测试 |
| 文章编号： | 0253-231X(2004)06-0995-03 |
| 修稿时间： | 2004年1月6日 |
AN EXPERIMENTAL STUDY OF THE PERFORMANCE AND THE CHARACTERISTICS OF HEAT SINKS OF ELECTRONIC CHIPS |
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| CHEN Xi-Zhang LIU Zhong-Liang MA Chong-Fang YU Jian.AN EXPERIMENTAL STUDY OF THE PERFORMANCE AND THE CHARACTERISTICS OF HEAT SINKS OF ELECTRONIC CHIPS[J].Journal of Engineering Thermophysics,2004,25(6):995-997. |
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| Authors: | CHEN Xi-Zhang LIU Zhong-Liang MA Chong-Fang YU Jian |
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| Abstract: | Heat Removal of electronic chips is crucial for the development of computer technology. For the time being, one of the most useful and widely used cooling methods of electronic chips is still the forced air convection heat sinks of various configurations. Therefore it is important that we could test and compare the performance and the characteristics of these heat sinks on a standard procedure. In this study, the experimental method and an experimental apparatus were set up and used to investigate the characteristics of two heat sinks of different types experimentally. From the analysis of the experimental data of both the steady state and the transient process of sudden jump heating and cooling a standard method for evaluation and testing of heat sink performance was proposed. |
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| Keywords: | heat sink simulative electronic chip characteristic testing |
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