Direct joining of glass substrates by 1 kHz femtosecond laser pulses |
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| Authors: | W Watanabe S Onda T Tamaki K Itoh |
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| Institution: | (1) Photonics Research Institute, National Institute of Advanced Industrial Science and Technology, 1-8-31, Midorigaoka, Ikeda, Osaka 563-8577, Japan;(2) Department of Material and Life Science, Graduate School of Engineering, Osaka University, 2-1, Yamadaoka, Suita, Osaka 565-0871, Japan |
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| Abstract: | When a femtosecond laser pulse is focused at the interface of two transparent substrates, localised melting and quenching
of the two substrates occur around the focal volume, bridging them due to nonlinear absorption. The substrates can then be
joined by resolidification of the materials. We investigate the optimum irradiation conditions needed to join borosilicate
glass substrates and fused silica substrates using a 1 kHz 800 nm Ti:sapphire amplifier. We characterised the joint strength
and the transmittance through joint volumes as a function of laser energy and translation velocity. We found that a joining
strength as large as 14.9 MPa could be obtained in both fused silica and borosilicate glass. Annealing the joint samples led
to an increase in the joint strength.
PACS 42.65.Jx; 42.70.Ce; 81.20.Vj |
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