| 紫外成像器件光电阴极封接焊料熔层缺陷对气密性的影响 |
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| 引用本文： | 徐江涛,杨晓军,张太民,韩昆烨.紫外成像器件光电阴极封接焊料熔层缺陷对气密性的影响[J].应用光学,2014,35(6):1054-1057. |
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| 作者姓名： | 徐江涛 杨晓军 张太民 韩昆烨 |
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| 作者单位： | 1.微光夜视技术重点实验室,陕西 西安 710065; |
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| 摘 要： | 为解决紫外成像器件光电阴极与管体封接漏气问题，对管体InSn合金熔化过程中出现的质量问题进行了深入分析，找出焊料熔层缺陷主要来源于对焊料除气不彻底和基底表面氧化及设备油污染。通过优化工艺参数，改进工艺质量和把化铟设备管体搁置焊料熔化改为浇铸熔化，使管体焊料熔化合格率达到了100%，光电阴极与管体封接气密性成品率达到98%。
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| 关 键 词： | 紫外成像器件 阴极封接 焊料缺陷 气密性 InSn合金层 |
Effect of photocathode sealing solder melting layer defect on gas tightness for ultraviolet imaging device |
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| Xu Jiangtao,Yang Xiaojun,Zhang Taimin,Han Kunye.Effect of photocathode sealing solder melting layer defect on gas tightness for ultraviolet imaging device[J].Journal of Applied Optics,2014,35(6):1054-1057. |
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| Authors: | Xu Jiangtao Yang Xiaojun Zhang Taimin Han Kunye |
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| Institution: | 1.Science and Technology on Low-Light-Level Night Vision Laboratory,Xi-an 710065,China;2.North Night Vision Science &Technology Group Co.Ltd,.Kunming 650223,China;3.Xi-an Institute of Applied Opitcs,Xi-an 710065,China |
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| Abstract: | To solve the problem of ultraviolet imaging device sealing leakage between the photocathode and the tube body, we deeply analyzed the quality problem of the tube body InSn alloy in melting process,and found out the solder melting layer defect came mainly from the incompletely solder degassing, the basal surface oxidation and the equipment contaminated with oil.Through optimizing the process parameters, we improved the process quality and changed the indium equipment of the tube body aside solder melting into casting molten,to make the qualified rate of the tube body solder melting reache 100% and the qualified rate of gas tightness between photocathode and tube body sealing yield to 98%. |
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| Keywords: | ultraviolet imaging device cathode sealing solder defects gas tightness InSn alloy layer |
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