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电泳沉积法制备YBaCuO厚膜工艺的研究
引用本文:李凤华,赵升升,王珏,樊占国.电泳沉积法制备YBaCuO厚膜工艺的研究[J].低温与超导,2003,31(2):26-28,32.
作者姓名:李凤华  赵升升  王珏  樊占国
作者单位:东北大学材料与冶金学院,沈阳,110004
摘    要:在极间距为 2 .5 cm的电泳容器中 ,以丙酮为分散介质 ,沉积速度随着粉末浓度和碘加入量的增加先增加后减小 ,最佳参数值 YBa Cu O粉末浓度 3g/ l,碘 0 .3/ l。在本实验设备条件下 ,外加直流电压应为 110 V。在 930℃下恒温 4小时就能达到固化效果 ,没有裂纹出现。固化膜对基带的附着力用划格法测量 ,按 ASTM( American Standards of Testing Mate-rial)标准可达 1级。

关 键 词:YBaCuO  厚膜  电泳沉积
修稿时间:2002年11月11

The Study on Preparing YBaCuO Thick Film with Electrophoretic Deposition Method
Li Fenghua,Zhao Shengsheng,Wang Jue,Fan Zhanguo.The Study on Preparing YBaCuO Thick Film with Electrophoretic Deposition Method[J].Cryogenics and Superconductivity,2003,31(2):26-28,32.
Authors:Li Fenghua  Zhao Shengsheng  Wang Jue  Fan Zhanguo
Abstract:The electrophoresis is proceeded in a vessel with a radius of 2.5cm. The depositing speed increased with the addition of powder and iodine at first, and then it reached the maximum when the powder concentration was 0.3g/l and the addition of iodine was 30mg/l. The applied electromotive force was determined as 110V in this work. The deposition time was about 5~10 minutes. The optimal sintering condition were 930℃ of temperature and 4 hours of sintering time. The adhesion of film to substrate reached 1 grade according to American Standard of Testing Materials.
Keywords:YBaCuO  Thick films  Electrophoresis
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