| 高温超导带材Bi-2223/Ag的焊接接头电阻研究 |
| |
| 引用本文： | 邵慧,严仲明,付磊,李海涛,王豫.高温超导带材Bi-2223/Ag的焊接接头电阻研究[J].低温与超导,2011,39(3):30-33. |
| |
| 作者姓名： | 邵慧 严仲明 付磊 李海涛 王豫 |
| |
| 作者单位： | 邵慧,付磊,王豫,Shao Hui,Fu Lei,Wang Yu(西南交通大学电气工程学院,成都,610031;西南交通大学磁浮技术与磁浮列车教育部重点实验室,成都,610031);严仲明,李海涛,Yan Zhongming,Li Haitao(西南交通大学电气工程学院,成都,610031) |
| |
| 摘 要： | 针对高温超导带材Bi-2223/Ag的焊接问题进行了研究.利用ANSYS建立焊接接头电阻特性的有限元计算模型,仿真和计算分析了焊料材料、搭接长度和焊锡层厚度对接头电阻值的影响,并进行了实验验证.实验表明:可通过减少焊料厚度,增加焊接搭接长度来减少接头电阻,当焊接长度在2～5cm,焊料厚度为0.5mm时,Bi-2223/...
|
| 关 键 词： | 接头电阻 焊接工艺 Bi-2223/Ag带材 |
Study on the welded splice between Bi-2223/Ag tapes |
| |
| Shao Hui,Yan Zhongming,Fu Lei,Li Haitao,Wang Yu.Study on the welded splice between Bi-2223/Ag tapes[J].Cryogenics and Superconductivity,2011,39(3):30-33. |
| |
| Authors: | Shao Hui Yan Zhongming Fu Lei Li Haitao Wang Yu |
| |
| Institution: | Shao Hui1,2,Yan Zhongming1,Fu Lei1,Li Haitao1,Wang Yu1,2(1.School of Electrical Engineering,Southwest Jiaotong University,Chengdu 610031,China,2.Key Laboratory of Magnetic Suspension Technology and Maglev Vehicle of Ministry of Education,China) |
| |
| Abstract: | This paper made systematical studies on the joint of Bi-2223/Ag HTS tape.The FEM simulation model of joint resistance property was established by ANSYS.It was used to simulate,analyse the effect of solder material,contact lenth and solder layer thickness on joint resistance.Experiment results showed that joint resistance could be reduced by decreasing the solder thickness and increasing the contact length.When the contact length was 2~5cm and the solder thickness was 0.5mm,the joint resistance of Bi-2223/Ag... |
| |
| Keywords: | Joint resistance Soldering technics Bi-2223/Ag tape |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
