| Bi-2223带材有阻焊接接头电阻特性的研究 |
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| 引用本文： | 张宏杰,宗军,王素丽,励庆孚.Bi-2223带材有阻焊接接头电阻特性的研究[J].低温物理学报,2006,28(3):275-279. |
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| 作者姓名： | 张宏杰 宗军 王素丽 励庆孚 |
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| 作者单位： | 1. 西安交通大学电气工程学院,西安,710049
2. 北京英纳超导技术有限公司,北京,100176 |
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| 基金项目： | 西安交通大学校科研和教改项目 |
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| 摘 要： | 本文针对Bi-2223/Ag带材接头有阻焊接展开研究,考虑大电流时超导I~V特性非线性影响,建立焊接接头电阻特性的有限元计算模型,总结出不同搭接距离和焊锡层厚度对接头电阻的影响规律,并着重分析了接头电阻对临界电流的影响,最终通过实验验证了理论分析得到的一些基本规律.为降低Bi-2223/Ag带材接头电阻对高温超导磁体运行时的不利影响,实际焊接时搭接距离应保证在7~10cm以上.
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| 关 键 词： | Bi-2223/Ag带材 焊接 接头电阻 |
| 收稿时间： | 10 26 2005 12:00AM |
| 修稿时间： | 12 7 2005 12:00AM |
STUDY ON JOINT PROPERTIES OF Bi-2223/Ag TAPE |
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| ZHang Hong-Jie,Zong Jun,Wang Su-Li,Li Qing-Fu.STUDY ON JOINT PROPERTIES OF Bi-2223/Ag TAPE[J].Chinese Journal of Low Temperature Physics,2006,28(3):275-279. |
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| Authors: | ZHang Hong-Jie Zong Jun Wang Su-Li Li Qing-Fu |
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| Abstract: | Long lengths of BSCCO-2223/Ag tape with high performance are more difficult to fabricate than shorter lengths. In some commercial application, different superconducting components must be jointed. Jointing technique must be reliable and efficient electrical. Splicing of Bi-2223/Ag tape by soldering should be performed in a way leaving the splice with electrical properties just as good compared with un-spliced tape. This paper studies on the factors influencing the resistance in the joint. The finite element method was used to calculate the joint resistance and the critical current of the joint. The criterion to decrease the soldering resistance are summed up and the results are confirmed by experiments. |
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| Keywords: | Bi-2223/Ag tape soldering joint resistance |
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