HgCdTe红外探测器离子注入剂量优化研究

在中波响应波段的p型Hg_0.709Cd_0.291Te(MCT)分子束外延生长薄膜上，利用材料芯片技术获得叠加注入不同硼离子剂量的系列大光敏元面积(500μm×500μm)的n-op-p结.通过测量液氮温度下不同离子注入剂量单元的电流-电压特性和对零偏微分电阻R₀分析，观测到p-n结的性能与硼离子注入剂量明显的依赖关系.在另一片薄膜材料(镉组分值为0.2743)上通过该方法获得R₀A优于现有常规数值的探测器单元. 关键词： p-n结 离子注入 碲镉汞薄膜

Optimizing boron implantation dose of HgCdTe infrared detectors

Using the material chip technology,large area photodiodes of n-on-p structure with different boron implantation dose are fabricated on the Hg_1-xCd_xTe film for mid-infrared wavelength region(x=0.291).Current-voltage characteristics of the photodiodes are measured at 77K and zero bias resistance-area products of different photodiodes are fitted from the data in the voltage range of -0.2—0.08V.The study indicated that the R₀A products of different elements depended distinctly upon the implanted boron dose.A large R₀ value has also obtained in another chip with x=0.2743.All the samples in this study are grown by Riber 32P molecular-beam epitaxy system and all the junctions-forming process is same to the standard planar technology but using a series of metallic masks during the boron ion implantation.