多弧离子镀工艺对TiN/Ti与Cr/Cu界面及微结构的影响

用多弧离子镀技术在铜基上电镀Cr/Ni层进行不同工艺条件下多弧离子沉积TiN/Ti实验.借助X射线衍射(XRD)和扫描电子显微镜(SEM)研究了TiN/Ti与Cr/Cu接触界面形成、微结构及其组分与形貌.XRD分析显示，薄膜表面组分包含TiN,Ti₂N多晶相外，还包含一些Cr-Ti的金属间化合物等.显然，TiN,Ti₂N在表面上已形成.SEM观察指出，在90℃制备的表面膜具有不平整的类枝状结晶结构.随着温度升高至170℃，得到精细TiN/Ti覆盖层表面，XRD峰 关键词： 多弧离子镀 氮化钛 界面形成 微结构

INFLUENCE OF MULTI-ARC ION PLATING TECHNIQUE ON THE INTERFACE AND MICROSTRUCTURE OF TiN/Ti AND Cr/Cu CONTACT SYSTEM

TiN/Ti film was fabricated by deposition on the chromium layer electrodeposited on the copper substrate by means of multi-arc ion plating technique under different conditions.The interface formation,microstructure and constituents,and morphology for TiN/Ti and Cr/Cu contact system are investigated using X-ray diffraction (XRD) and scanning electron microscope (SEM) techniques.The XRD measurements showed that in addition to the TiN,Ti₂N multi-crystallized phases,there was a lot of Cr-Ti,intermetallic compounds on the surface of TiN/Ti film.It is evident that the Ti₂N phase was formed.The SEM observation indicated that the surface film prepared at 90℃,had a structure similar to the form of branches and an inhomogeneous crystallization had occurred.As the temperature was increased to 170℃,the XRD peak intensity became stronger and a fine TiN/Ti surface was obtained.