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瞬态大电流测量结温中校温曲线弯曲现象的研究
引用本文:郭春生,王琳,翟玉卫,李睿,冯士维,朱慧.瞬态大电流测量结温中校温曲线弯曲现象的研究[J].物理学报,2015,64(18):184704-184704.
作者姓名:郭春生  王琳  翟玉卫  李睿  冯士维  朱慧
作者单位:北京工业大学电子信息与控制工程学院, 北京 100124;中国电子科技集团第十三研究所, 石家庄 050051
基金项目:国家自然科学基金(批准号: 61204081)资助的课题.
摘    要:利用脉宽250 μs、占空比5%的0–1.5 A脉冲电流, 分别在50, 70, 90, 110, 130 ℃条件下, 对TO-247-2L封装型PIN快恢复二极管大电流下的校温曲线进行了测量分析. 研究发现, 恒定大电流条件下, 二极管的校温曲线随温度变化发生弯曲. 分析表明, 弯曲现象主要是由于串联电阻受迁移率的影响随温度发生变化而引起的. 通过实验测量及理论计算, 得到了准确的非线性校温曲线, 从而减小了瞬态大电流测量结温中的误差.

关 键 词:二极管  瞬态大电流  校温曲线  串联电阻
收稿时间:2015-02-01

Bending phenomenon of temperature calibration curve in junction temperature measurement by the high transient current
Guo Chun-Sheng,Wang Lin,Zhai Yu-Wei,Li Rui,Feng Shi-Wei,Zhu Hui.Bending phenomenon of temperature calibration curve in junction temperature measurement by the high transient current[J].Acta Physica Sinica,2015,64(18):184704-184704.
Authors:Guo Chun-Sheng  Wang Lin  Zhai Yu-Wei  Li Rui  Feng Shi-Wei  Zhu Hui
Institution:College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100124, China;The 13th Research Institute Of China Electronics Technology Group Corporation, Shijiazhuang 050051, China
Abstract:To measure the junction temperature of diodes under operating conditions, the temperature calibration curve is studied under large current conditions. To avoid the self heating by the large current conditions, pulsed currents are used in the paper. The temperature calibration curve of TO-247-2L fast recovery diode is investigated in this paper. The 0-1.5 A pulse current, of which the pulse width is 250 μs and the duty cycle is 5%, is chosen to study the temperature calibration curves under 50, 70, 90, 110, 130 ℃ respectively.#br#The results show that under the large current condition, the temperature calibration curve bends. The main reason for the bending phenomenon is that the series resistance changes with temperature increasing, which is affected by the mobilities of electrons and holes in semiconductor material. With the temperature rising, the mobility decreases, which results in the increasing of series resistance. Due to the series resistance increasing The voltage on p-n junction will be reduced. For this reason, a higher voltage is needed to obtain the same current, and the temperature calibration curve will bend.#br#There are two reasons which will lead to the temperature rising. The first reason is self-heating of devices by the power dissipation, and the second reason is that the temperature of device is heated by ambient temperature. Under the same temperature, self-heating behaviors of device by different currents will result in different series resistances. But in the paper, the results show that the series resistances under different currents are the same, which illustrates that self-heating is not the key reason for the change of series resistance. So, the temperature changing of the diode is caused by the ambient temperature rising, which verifies that the bending phenomenon of the temperature calibration curve of TO-247-2L fast recovery diode is caused by the ambient temperature rising.#br#Then, through experimental measurements and theoretical calculations, the accurate nonlinear temperature calibration curve is acquired, which can reduce the measurement errors of high current transient junction temperature.
Keywords:diode  the high transient current  temperature calibration curve  series resistance
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