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化学机械抛光中纳米颗粒的作用分析
引用本文:张朝辉,雒建斌,温诗铸.化学机械抛光中纳米颗粒的作用分析[J].物理学报,2005,54(5):2123-2127.
作者姓名:张朝辉  雒建斌  温诗铸
作者单位:(1)北京交通大学机电学院,100044; (2)清华大学摩擦学国家重点实验室,100084
基金项目:国家自然科学基金(批准号:50390060)资助的课题
摘    要:化学机械抛光(chemical mechanical polishing, CMP)是用于获取原子级平面度的有效手 段.目前,CMP的抛光液通常使用纳米级颗粒来加速切除和优化抛光质量.这类流体的流变性 能必须考虑微极性效应的影响.对考虑微极性效应的运动方程的求解,有助于了解CMP的作用 机理.数值模拟表明,微极性将提高抛光液的等效黏度从而在一定程度上提高其承载能力, 加速材料去除.这在低节距或低转速下尤为明显,体现出其具有尺寸依赖性.通过改变抛光液 中粒子的微极性,用实验研究了微极性效应对CMP中材料去除速率的影响,证明了分析的合 理性. 关键词: 化学机械抛光 微极流体 抛光液 流变特性 材料去除速率

关 键 词:化学机械抛光  微极流体  抛光液  流变特性  材料去除速率
文章编号:1000-3290/2005/54(05)2123-05
收稿时间:2004-09-16

Effects of nano-scale particles in chemical mechanical polishing process
Zhang Chao-Hui,Luo Jian-Bin,Wen Shi-Zhu.Effects of nano-scale particles in chemical mechanical polishing process[J].Acta Physica Sinica,2005,54(5):2123-2127.
Authors:Zhang Chao-Hui  Luo Jian-Bin  Wen Shi-Zhu
Abstract:Chemical mechanical polishing(CMP) is a manufacturing process used to achieve th e high levels of global and local planarity required. Currently, the slurries us ed in CMP usually contain particles at nano scale to accelerate the material rem ove ratio (MRR) and to optimize the planarity. Micro polar theory will provide a feasible candidate to describe the rheology of these fluids. It will provide so me insights into the mechanism to solve the flow equation of CMP with the micro- polar effect considered. The effects of micro polarity on load and moments are s imulated and computation results are given. The results show that micro-polarity will give rise to an increase in load capacity to a certain extent by increasin g the equivalent viscosity of the slurries, through which the material removal c an be accelerated. The size-dependent feature can be seen since it becomes more prominent with low pitch height and low pad velocity. The effects of micro-polar ity on material removal rate in CMP process were experimentally investigated by altering the polarity of the slurries, which support the theoretical analysis.
Keywords:CMP  micro-polar fluids  slurry  rheology  material removal rate
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