金刚石薄膜的结构特征对薄膜附着性能的影响

在不同实验条件下，用微波等离子体化学气相沉积设备在硬质合金(WC+6%Co)衬底上沉积了 具有不同结构特征的金刚石薄膜.用Raman谱表征薄膜的品质和应力，用压痕实验表征薄膜的 附着性能，考察了薄膜中sp²杂化碳含量、形核密度、薄膜厚度对薄膜附着性能 的影响.结 果表明：sp²杂化碳的缓冲作用使薄膜中sp²杂化碳的含量对薄膜中 残余应力有较大的影 响，从而使薄膜压痕开裂直径统计性地随sp²杂化碳含量的增加而减小；仅仅依 靠超声遗 留的金刚石晶籽提高形核密度并不能有效改变薄膜与硬质合金基体之间的化学结合状况，从 而不能有效提高薄膜在衬底上的附着性能；在薄膜较薄时，晶粒之间没有压应力的存在，开 裂直径并不明显随厚度增加而增加，只有当薄膜厚度增加到一定值，晶粒之间才有较强压应 力存在，开裂直径随厚度的增加而较为迅速地增加. 关键词： 金刚石薄膜 附着性能 2杂化碳')" href="#">sp²杂化碳 成核密度 薄膜厚度

Influence of structure on adhesion of grains in CVD diamond films

Diamond thin films of different structures were prepared by using chemical vapor deposition on WC(6%Co) substrates under different conditions.Reman spectroscopy was used for the quality evaluation of the diamond films.The cracking size in indentation tests was used for the evaluation of adhesion strength,and the influence of structure of diamond films on the adhesion was studied.Results obtained show that: (1) The buffer role of sp²_carbon between grain boundaries greatly affect the residual stress of the film,hence the cracking size decreases steadily with increasing sp² content.(2) The increase of nucleation density is mainlyh due to the contribution of the diamond seed grains left. In this case,the increase of nucleation density cannot effectively improve the chemical adhesioe force between the film and the WC substrate,and cannot improve the adhesion between the film and the substrate.(3)For thinner films there is no compressive stress among diamond grains,hence the cracking size does n t increase apparently with increasing deposition time.Strong compressive stress emerges only after the thickness increases to a certain value,and then the cracking size increases rapidly with increasing deposition time.