真空退火对Ni80Fe20/Cu多层膜微结构的影响

用直流磁控溅射法在Si(001)衬底上制备了以Ta为缓冲层、含有15周期的Ni₈₀Fe₂₀（4nm)/Cu(6nm)多层膜.样品分别在150,250,350℃进行了真空退火处理.用低角和高角X射线衍射法研究了多层膜的微结构.结果表明，所有样品均有较好的111] 取向，而且随退火温度或时间的增加，111]取向程度变得更高.超晶格周期、平均面间距在退火后略有减小，表明多层膜结构在退火后变得更为致密.多层膜界面粗糙度随退火温度或时间的增加而增大，平均相关长度随退火温度或时间的增加而减小，分析认为这是由于Ni₈₀Fe₂₀/Cu界面存在严重的互扩散所导致的.模拟Ni₈₀Fe₂₀/Cu多层膜高角X射线衍射谱，发现在Ni₈₀Fe₂₀/Cu蜀面有非常厚的混合层存在，而且混合层厚度随退火温度或时间的增加而增大.模拟结果还表明，随退火温度或时间的增加，Ni₈₀Fe₂₀层面间距几乎保持不变，Cu层面间距则随退火温度的增加而略有减小. 关键词：

Effect of Annealing on Microstructure of Ni80Fe20/Cu Multilayers

Ni₈₀Fe₂₀/Cu]₁₅ multilayers were fabricated by dc-magnetron sputtering and annealed at 150, 250 and 350℃, respectively. The structures were investigated by low-angle and high-angle X-ray diffraction. It was found that, as the annealing temperature increases, the 111] preferred orientation of superlattices is improved slightly, while the superlattice period, interplane distance, average multilayer coherence length decrease. The interfacial roughness increases with the increase of annealing temperature and/or annealing time, this can be attributed to the Ni₈₀Fe₂₀ and Cu sublayers has been revealed by simulation of high-angle X-ray diffraction, and its thickness increases as the annealing temperature of annealing time increases. The simulation results furthermore showed that the interplane distances of the Ni₈₀Fe₂₀ layer keeps constant, and that the Cu layer decreases slightly as the annealing temperature increases.