新型槽栅PMOSFET热载流子退化机理与抗热载流子效应研究

分析了槽栅器件中的热载流子形成机理，发现在三个应力区中，中栅压附近热载流子产生概率达到最大.利用先进的半导体器件二维器件仿真器研究了槽栅和平面PMOSFET的热载流子特 性，结果表明槽栅器件中热载流子的产生远少于平面器件，且对于栅长在深亚微米和超深亚 微米情况下尤为突出.为进一步探讨热载流子加固后对器件特性的其他影响，分别对不同种 类和浓度的界面态引起的器件栅极和漏极特性的漂移进行了研究，结果表明同样种类和密度 的界面态在槽栅器件中引起的器件特性的漂移远大于平面器件.为开展深亚微米和亚0.1微米 新型槽栅 关键词： 槽栅PMOSFET 热载流子退化机理 热载流子效应

STUDY ON THE HOT-CARRIER-DEGRADATION MECHANISM AND HOT-CARRIER-EFFECT IMMUNITY I N ADVANCED GROOVED-GATE PMOSFET

In this paper,the hot-carrier mechanism in grooved-gate MOS is analyzed at first .It is found that the hot-carrier effect reaches its highest generate rate under medium gate bias voltage of the three stress areas.Then,the characteristics of hot-carrier-effect in grooved-gate and planar PMOSFET are simulated using advanc ed 2-dimensional device simulator.The results show that the hot-carrier generate d in grooved-gate PMOSFET is far less than in planar PMOSFET,especially for the case of channel length in deep-sub-micron and super deep-sub-micron region.In or der to investigate the other influences of hot-carrier-effect immunity on device characteristics,the drift of gate and drain characteristics induced by differen t interface state is studied for grooved-gate and planar devices.It shows that t he drift induced by same interface state in grooved-gate MOSFET is far larger th an in planar device.This work lays a foundation for the research and design of n ovel very-small-size grooved gate CMOS devices.