银和铜膜中异常晶粒生长和织构变化的实验研究

用透射电子显微镜(TEM)和x射线衍射(XRD)方法对经300℃，2h退火的Ag和Cu自由膜和Si基体上的Ag和Cu附着膜的异常晶粒生长和织构变化进行了实验研究.XRD分析表明：Ag和Cu沉积膜均有(111)和(100)择优取向.但经退火处理后，Ag和Cu自由膜的(111)织构稍有加强.相反，Si基体上的Ag和Cu附着膜的(100)和(110)织构明显加强，同时用TEM在Cu附着膜中观察到了两个(110)和四个(211)取向的异常大晶粒.根据表面能和应变能的各向异性对实验结果进行了分析.

Investigation of abnormal grain growth andtexture change in Ag and Cu films

Abnormal grain growth and texture change in free-standing Ag and Cu films and those attached to the Si substrates have been investigated with transmission electron microscopy (TEM) and x-ray diffraction (XRD) analysis, after annealing the samples at 300℃ for 2 h.The as-deposited Ag and Cu films, as shown by XRD analysis, have(111) and (100) preferred orientations. After annealing, the free-standing films show a slight increase in the (111) texture, while the films attached to the silicon substrates show strong increases in the (100) and (110) textures. Two anomalous large grains with (110) orientation and four anomalous large grains with (211) orientation are observed by TEM in the attached Cu film after annealing. The results are discussed from an energy point of view.