绿色环保化学机械抛光液的研究进展

原子级加工制造是实现半导体晶圆原子尺度超光滑表面的有效途径.作为大尺寸高精密功能材料的原子级表面制造的重要加工手段之一,化学机械抛光(chemical mechanical polishing,CMP)凭借化学腐蚀和机械磨削的耦合协同作用,成为实现先进材料或器件超光滑无损伤表面平坦化加工的关键技术,在航空、航天、微电子等众多领域得到了广泛应用.然而,为了实现原子层级超滑表面的制备,CMP工艺中常采用的化学腐蚀和机械磨削方法需要使用具有强烈腐蚀性和高毒性的危险化学品,对生态系统产生了不可逆转的危害.因此,本文以绿色环保高性能抛光液作为对象,对加工原子量级表面所采用的化学添加剂进行分类总结,详尽分析在CMP过程中化学添加剂对材料表面性质调制的作用机理,为在原子级尺度下改善表面性质提供可参考的依据.最后,提出了CMP抛光液在原子级加工研究中面临的挑战,并对未来抛光液发展方向作出了展望,这对原子尺度表面精度的进一步提升具有深远的现实意义.

Research progress of green chemical mechanical polishing slurry

Atomic-scale fabrication is an effective way to realize the ultra-smooth surfaces of semiconductor wafers on an atomic scale.As one of the crucial manufacturing means for atomically precise surface of large-sized functional materials,chemical mechanical polishing(CMP)has become a key technology for ultra-smooth and non-damage surface planarization of advanced materials and devices by virtue of the synergetic effect of chemical corrosion and mechanical grinding.It has been widely used in aviation,aerospace,microelectronics,and many other fields.However,in order to achieve ultra-smooth surface processing at an atomic level,chemical corrosion and mechanical grinding methods commonly used in CMP process require some highly corrosive and toxic hazardous chemicals,which would cause irreversible damage to the ecosystems.Therefore,the recently reported green chemical additives used in high-performance and environmentally friendly CMP slurry for processing atomically precise surface are summarized here in this paper.Moreover,the mechanism of chemical reagents to the modulation of materials surface properties in the CMP process is also analyzed in detail.This will provide a reference for improving the surface characteristics on an atomic scale.Finally,the challenges that the polishing slurry is facing in the research of atomic-scale processing are put forward,and their future development directions are prospected too,which has profound practical significance for further improving the atomic-scale surface accuracy.