Accuracy and sensitivity of a hole drilling and digital speckle pattern interferometry combined technique to measure residual stresses

This paper reports on the accuracy and sensitivity of digital speckle pattern interferometry (DSPI) when it is combined with the hole drilling technique for measuring residual stresses. The in-plane displacement field generated by the introduction of a small hole is determined using an automated data analysis approach. This method is based on the calculation of the optical phase distribution through a phase-shifting method and the application of a robust iterative phase unwrapping algorithm. It is experimentally demonstrated that residual stresses can be measured with a relative uncertainty of 7.5%. It is also shown that the minimum value of residual stress that can be determined with the DSPI and hole drilling combined technique is about 10% of the yield stress of the material.