剪切载荷作用下含损伤胶接材料界面动应力强度因子的研究

主要针对剪切载荷作用下，胶接材料接合区域界面裂纹尖端动态应力强度因子进行了分析，其中考虑了裂尖区域的损伤．通过积分变换，引入位错密度函数，奇异积分方程被简化为代数方程，并采用配点法求解；最后经过Laplace逆变换，得到动态应力强度因子的时间响应．Ⅱ型动应力强度因子随着黏弹性胶层的剪切松弛参量、弹性基底的剪切模量和Poisson比的增加而增大；随膨胀松弛参量的增加而减小．损伤屏蔽发生在裂纹扩展的起始阶段．裂纹尖端的奇异性指数(-0.5)是与材料参数、损伤程度和时间无关的，而振荡指数由黏弹性材料参数控制．

Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading

The dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading is investigated. The material damage was considered. By introducing dislocation density function and using integral transform, the problem was reduced to algebraic equations and could be solved with collocation dots method in the Laplace domain. Finally, the time response of DSIF was calculated with the inverse Laplace integral transform. The conclusions show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, but decreases with swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is 0.5 and independent of the material parameters and damage conditions of materials and time. The oscillatory index is controlled by viscoelastic material parameters.