Hot-carrier degradation for 90nm gate length LDD-NMOSFET with ultra-thin gate oxide under low gate voltage stress |
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Authors: | Chen Hai-Feng Hao Yue Ma Xiao-Hu Li Kang and Ni Jin-Yu |
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Institution: | School of Microelectronics, Xidian University, Xi'an 710071, China |
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Abstract: | The hot-carrier degradation for 90~nm gate length lightly-doped drain
(LDD) NMOSFET with ultra-thin (1.4~nm) gate oxide under the low gate
voltage (LGV) (at Vg=Vth, where Vth is the
threshold voltage) stress has been investigated. It is found that the
drain current decreases and the threshold voltage increases after the
LGV (Vg=Vth stress. The results are opposite to the
degradation phenomena of conventional NMOSFET for the case of this
stress. By analysing the gate-induced drain leakage (GIDL) current
before and after stresses, it is confirmed that under the LGV stress
in ultra-short gate LDD-NMOSFET with ultra-thin gate oxide, the hot
holes are trapped at interface in the LDD region and cannot shorten
the channel to mask the influence of interface states as those in
conventional
NMOSFET do, which leads to the different degradation phenomena from those of the
conventional NMOS devices. This paper also discusses the degradation in the
90~nm gate length LDD-NMOSFET with 1.4~nm gate oxide under the LGV stress at
Vg=Vth with various drain biases. Experimental results show that
the degradation slopes (n) range from 0.21 to 0.41. The value of
n is
less than that of conventional MOSFET (0.5-0.6) and also that of the long gate
length LDD MOSFET (\sim0.8). |
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Keywords: | threshold voltage lightly doped drain gate-induced
drain leakage current hot hole |
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